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Cold Plates & Server Modules
Liquid-cooled cold plates bring heat directly from CPU, GPU, ASIC, and optical module interfaces into the working fluid, enabling higher rack densities and lower fan dependency.
Advanced Liquid Cooling
Full-Chain Liquid Cooling Solution
One coherent cooling chain moves heat from CPU, GPU, ASIC, and optical module interfaces through rack-level distribution, CDU-based heat exchange, and compatible outdoor heat rejection systems.
Solution Architecture
2500 kWMaximum in-row CDU heat exchange capacity
1500 WMaximum single-ASIC cooling support
1200 WMaximum single-GPU cooling support
9 LayersLong-life coolant protection mechanism
Our Approach
Implementation Approach
The solution transfers heat through direct-to-chip cold plates, routes fluid through quick disconnects and manifolds, manages heat exchange through CDU systems, and rejects heat through dry coolers or cooling towers. The whole chain is supported by leak detection, water quality monitoring, and anti-condensation control.
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Quick Disconnects & Manifolds
Drip-less quick disconnects and precision manifolds improve serviceability while providing reliable fluid routing and flow distribution at the rack level.
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Secondary Loop & CDU Control
Prefabricated stainless-steel piping and CDU units manage flow, temperature, pressure, filtration, expansion, and automatic replenishment with support for online maintenance.
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Outdoor Heat Rejection & Monitoring
Heat is rejected through compatible dry cooler or cooling tower configurations, supported by leak detection, water quality monitoring, and anti-condensation logic.
Validation
Thermal Validation
Beyond liquid cooling delivery, the solution can incorporate airflow organization simulation and supplemental airflow verification to improve thermal uniformity at rack and room levels. Simulation-based analysis helps identify recirculation hotspots and optimize the interaction between liquid-cooled racks and the surrounding white space.
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Simulation-driven Thermal Validation
The verification workflow supports CFD-based airflow assessment, local hotspot identification, and supplemental fan strategy validation for high-density deployments, reducing commissioning risk before large-scale rollout.
Our Solution
Core Module Snapshot
The solution can be configured at rack, row, or room level, combining cold plates, quick disconnects, manifolds, CDU options, long-life coolant, leak detection, and compatible outdoor cooling infrastructure.
Cold Plates & Server-Side Cooling
Supports CPU, GPU, ASIC, switch, and related electronics cooling scenarios with customized development capability.
Fluid Distribution & Rack Integration
Provides manifold, quick disconnect, piping, and rack-side integration capability for secure and efficient fluid routing.
CDU, Coolant & Smart Monitoring
Brings together heat exchange, fluid protection, control logic, and condition monitoring into an integrated operating platform.
| Module | Key Capability | Typical Data | Value |
|---|---|---|---|
| CPU / GPU / ASIC Cold Plates | Direct-to-chip liquid cooling | Memory cooling up to 28W; GPU up to 1200W; ASIC up to 1500W; support for 400G / 800G / 1.6T optical module cooling | Supports high-density compute platforms |
| Quick Disconnect | Fast connection and drip-less servicing | Multiple diameters and material options; pressure-capable disconnection | Reduces fluid handling workload |
| Manifold | Rack-level fluid distribution | SUS304 / SUS316L; up to ±0.15mm position accuracy | Supports uniform flow distribution |
| In-Row CDU | Large-capacity liquid-to-liquid heat exchange | 300 / 600 / 800 / 1400 / 2500kW; 10%-100% flow regulation | Suitable for centralized liquid cooling |
| SoluKing Long-Life Coolant | Fluid protection across the entire chain | 9-layer protection; freezing point down to -40°C | Helps maintain long-term stability |
Ready for high-density AI and HPC thermal modernization
From server-side cold plates to outdoor heat rejection, the full-chain liquid cooling solution helps customers deploy denser infrastructure, reduce cooling complexity, and operate with clearer monitoring across the entire thermal loop.
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